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Fa'afefea ona Filifili Lau Fa'auma mo lau PCB Design

Ⅱ Iloiloga ma Faatusatusaga

Fa'asalalau: Nov 16, 2022

Vaega: Blogs

Fa'ailoga: pcb,pcba,potopotoga pcb,pcb gaosiga, pcb luga fa'auma

E tele fa'amatalaga e uiga i le fa'auma o luga, e pei ole HASL e leai se ta'ita'i e iai le fa'afitauli e maua ai le mafolafola faifai pea.O le Electrolytic Ni/Au e matua taugata lava ma afai e tele naua auro e teuina i luga o le papa, e mafai ona oʻo atu i soʻo faʻamau.Faatofu apa ua solderability degradation ina ua uma ona aafia i le tele o taamilosaga vevela, e pei o le pito i luga ma le pito i lalo PCBA reflow faagasologa, ma isi.O le laulau o lo'o i lalo o lo'o fa'aalia ai se su'esu'ega fa'apitoa mo fa'au'uga fa'apipi'i masani o laupapa fa'asalalau lolomi.

Table1 Fa'amatalaga puupuu o le gaosiga o gaosiga, tulaga lelei ma le le lelei, ma fa'aoga masani o ta'uta'ua ta'uta'ua fa'amae'aina luga ole PCB

PCB Laugata Maea

Fa'agasologa

mafiafia

Tulaga lelei

Fa'aletonu

Talosaga masani

HASL leai se ta'ita'i

O laupapa PCB e faatofuina i totonu o se ta'ele apa u'amea ona feulaina lea e naifi ea vevela mo pati mafolafola ma le tele o solder aveese.

30µin(1µm) -1500µin(40µm)

Lelei Solderability;Tele avanoa;E mafai ona toe faʻaleleia / toe faʻaleleia;Uumi fata umi

Laufanua e le tutusa;Te'i vevela;Le lelei le susu;Alalaupapa solder;PTH fa'apipi'i.

Fa'aaoga lautele;E fetaui mo pads tetele ma le va;Le fetaui mo HDI ma <20 mil (0.5mm) le lelei pitch ma BGA;Le lelei mo PTH;Le fetaui mo PCB apamemea mafiafia;E masani lava, fa'aoga: Fa'atonu laupapa mo su'ega eletise, fa'amauina lima, nisi mea fa'aeletonika maualuga fa'atino e pei ole va'alele ma masini a le militeri.

OSP

Fa'aaogā fa'ama'i se mea fa'aola i luga o laupapa e fai ai se u'amea fa'aola e puipuia ai le 'apamemea fa'aalia mai le 'ele.

46µin (1.15µm)-52µin(1.3µm)

Tau maualalo;Pads e toniga ma mafolafola;Lelei solderability;E mafai ona tu'ufa'atasi ma isi fa'auma;E faigofie le faiga;E mafai ona toe galue (i totonu o le faleaoga).

Ma'ale'ale ile taulimaina;Puupuu le ola fa'asa.Fa'atapula'a solder sosolo;Fa'aleagaina le solderability ma le maualuga o le vevela & taamilosaga;Nonconductive;Faigata ona asiasia, su'esu'e ICT, ionic & press-fit atugaluga

Fa'aaoga lautele;E fetaui lelei mo SMT / lelei pitches / BGA / vaega laiti;Auauna laupapa;Le lelei mo PTH;E le fetaui mo tekinolosi crimping

ENIG

O se fa'agasologa o vaila'au e fa'apipi'i ai le kopa fa'aalia i le Nikeli ma le Auro, o lea e aofia ai se vaega fa'alua o le fa'alavalava fa'ameamea.

2µin (0.05µm)– 5µin (0.125µm) o Auro i luga atu o le 120µin (3µm)– 240µin (6µm) o Nikeli

Solderability lelei;Pads e laugatasi ma toniga;Al uaea fe'avea'i;Laiti fa'afeso'ota'i tetee;Fa'aumi umi;Lelei le pala ma le tumau

popolega "Black Pad";Fa'ailo gau mo fa'ailoga fa'amaoni talosaga;le mafai ona toe galue

Lelei mo le Fa'apotopotoga o le fa'apipi'i lelei ma le fa'apipi'iina o luga o le mauga (BGA, QFP...);Lelei mo le tele o ituaiga Soldering;E sili atu mo le PTH, lolomi fetaui;Uaea Bondable;Fautuaina mo le PCB ma le maualuga le faʻatuatuaina talosaga e pei o le aerospace, militeli, fomaʻi ma tagata faʻatau maualuga, ma isi;E le fautuaina mo Touch Contact Pads.

Electrolytic Ni/Au (Auro vaivai)

99.99% mama - 24 carat Auro faʻaaogaina i luga o le nickel layer e ala i se faiga eletise aʻo leʻi faia le soldermask.

99.99% Auro mama, 24 Karat 30µin (0.8µm) -50µin (1.3µm) i luga ole 100µin (2.5µm) -200µin (5µm) o Nickel

Malo ma'a'a ma le tumau;Tele conductivity;Mafolafola;Al uaea fe'avea'i;Laiti fa'afeso'ota'i tetee;E umi le ola

Taugata;Au embrittlement pe afai mafiafia tele;Fa'atonuga fa'alavelave;Fa'aopoopo galuega/faigaluega malosi;E le fetaui mo le soiina;O le ufiufi e le tutusa

E masani ona faʻaaogaina i le uaea (Al & Au) faʻapipiʻi i totonu o pusa atigipusa e pei ole COB (Chip on Board)

Electrolytic Ni/Au (Auro malo)

98% mama – 23 carat Auro fa'atasi ma fa'ama'a'a fa'aopoopo i le ta'ele fa'apipi'i fa'aoga i luga o le nickel layer e ala i se faiga fa'aeletise.

98% auro mama, 23 Karat30μin(0.8μm) -50μin(1.3μm) i luga ole 100μin(2.5μm) -150μin(4μm) o Nickel

Solderability lelei;Pads e laugatasi ma toniga;Al uaea fe'avea'i;Laiti fa'afeso'ota'i tetee;Toe fai

Fa'aleaga (taulimaina & teuina) a'a ile si'osi'omaga maualuga o le sulfur;Fa'aitiitiga filifili filifili sapalai e lagolago ai lenei fa'ai'uga;Fa'amalama pu'upu'u fa'aogaina i le va o fa'apotopotoga.

E masani ona faʻaaogaina mo fesoʻotaʻiga eletise e pei o fesoʻotaʻiga pito (tamailima auro), laupapa vaʻavaʻa IC (PBGA/FCBGA/FCCSP...), Keyboards, fesoʻotaʻiga maa ma nisi pads suʻega, ma isi.

Faatofu Ag

o se mea siliva e teuina i luga o le 'apamemea e ala i se faiga faʻapipiʻi eletise pe a uma le etch ae aʻo leʻi faia le soldermask

5µin(0.12µm) -20µin(0.5µm)

Solderability lelei;Pads e laugatasi ma toniga;Al uaea fe'avea'i;Laiti fa'afeso'ota'i tetee;Toe fai

Fa'aleaga (taulimaina & teuina) a'a ile si'osi'omaga maualuga o le sulfur;Fa'aitiitiga filifili filifili sapalai e lagolago ai lenei fa'ai'uga;Fa'amalama pu'upu'u fa'aogaina i le va o fa'apotopotoga.

Su'ega tau tamaoaiga i le ENIG mo Fine Traces ma BGA;Lelei mo le faʻaogaina o faailoilo maualuga;Lelei mo suiga o le membrane, puipui EMI, ma faʻapipiʻi uaea alumini;E talafeagai mo lomitusi fetaui.

Faatofu Sn

I totonu o se ta'ele kemikolo e leai se eletise, o se vaega manifinifi pa'epa'e o Tin e teu sa'o i luga o le 'apamemea o laupapa fa'asalalau e fai ma pa mo le aloese mai le fa'ama'iina.

25µin (0.7µm)-60µin(1.5µm)

E sili ona lelei mo tekinolosi fetaui lelei;Tau-lelei;Planar;Lelei solderability (pe a fou) ma faatuatuaina;Mafolafola

Fa'aleagaina le solderability fa'atasi ai ma le maualuga o le taimi & ta'amilosaga;E mafai ona pala;Taulimaina o mataupu;Tin Wiskering;Le fetaui mo PTH;O loʻo i ai Thiourea, o se Carcinogen lauiloa.

Fautuaina mo gaosiga tetele;Lelei mo le tuʻuina o SMD, BGA;Lelei mo lomitusi fetaui ma vaalele tua;E le fautuaina mo le PTH, fa'afeso'ota'i ki, ma le fa'aogaina i matapulepule peelable

Table2 O se iloiloga o meatotino masani o le PCB Fa'aonaponei Fa'auma Fa'auma ile gaosiga ma le fa'aogaina

Gaosiga o fa'auma fa'aoga masani

Meatotino

ENIG

ENEPIG

Auro vaivai

Auro malo

IAg

ISn

HASL

HASL-LF

OSP

Ta'uta'ua

Maualuga

Maulalo

Maulalo

Maulalo

Alafua

Maulalo

Maulalo

Maualuga

Alafua

Tau o Fa'agasologa

Maualuluga (1.3x)

Maualuluga (2.5x)

Maualuga (3.5x)

Maualuga (3.5x)

Ala (1.1x)

Ala (1.1x)

Maulalo (1.0x)

Maulalo (1.0x)

Maulalo (0.8x)

Teugatupe

Faatofu

Faatofu

Electrolytic

Electrolytic

Faatofu

Faatofu

Faatofu

Faatofu

Faatofu

Ola Fa'asa

Umi

Umi

Umi

Umi

Alafua

Alafua

Umi

Umi

Puupuu

RoHS tausisia

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

No

Ioe

Ioe

Laufanua Fa'atasi mo SMT

Lelei

Lelei

Lelei

Lelei

Lelei

Lelei

Mativa

Lelei

Lelei

Kopa Fa'aalia

No

No

No

Ioe

No

No

No

No

Ioe

Taulimaina

masani

masani

masani

masani

Mata'utia

Mata'utia

masani

masani

Mata'utia

Taumafaiga Fa'agasologa

Alafua

Alafua

Maualuga

Maualuga

Alafua

Alafua

Alafua

Alafua

Maulalo

Mafai toe galue

No

No

No

No

Ioe

E le fautuaina

Ioe

Ioe

Ioe

Taamilosaga vevela Manaomia

tele

tele

tele

tele

tele

2-3

tele

tele

2

Matā'upu musumusu

No

No

No

No

No

Ioe

No

No

No

Te'i vevela (PCB MFG)

Maulalo

Maulalo

Maulalo

Maulalo

Maualalo tele

Maualalo tele

Maualuga

Maualuga

Maualalo tele

Maualalo Tetee / Saosaoa maualuga

No

No

No

No

Ioe

No

No

No

N/A

Fa'aoga o fa'auma fa'aoga masani

Talosaga

ENIG

ENEPIG

Auro vaivai

Auro Malosi

IAg

ISn

HASL

LF-HASL

OSP

Malosi

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Fa'afoliga

Faatapulaaina

Faatapulaaina

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Flex-Ma'a'a

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Le Fiafia

Lelei Lelei

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Le Fiafia

Le Fiafia

Ioe

BGA & μBGA

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Le Fiafia

Le Fiafia

Ioe

Solderability Tele

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

Faatapulaaina

Su'e Chip

Ioe

Ioe

Ioe

Ioe

Ioe

Ioe

No

No

Ioe

Press Fit

Faatapulaaina

Faatapulaaina

Faatapulaaina

Faatapulaaina

Ioe

Lelei

Ioe

Ioe

Faatapulaaina

Uo-Pu

Ioe

Ioe

Ioe

Ioe

Ioe

No

No

No

No

Fa'amauina uaea

Ioe (Al)

Ioe (Al, Au)

Ioe (Al, Au)

Ioe (Al)

Fesuia'i (Al)

No

No

No

Ioe (Al)

Solder Susū

Lelei

Lelei

Lelei

Lelei

Lelei tele

Lelei

Mativa

Mativa

Lelei

Solder Soofaatasi Amiotonu

Lelei

Lelei

Mativa

Mativa

Lelei

Lelei

Lelei

Lelei

Lelei

Ole ola fa'aola ose elemene taua e tatau ona e mafaufau i ai pe a fai au fa'asologa o gaosiga.Ola Fa'asao le faʻamalama galue lea e tuʻuina atu ai le faʻamaeʻaina e maua ai le atoatoa PCB weldability.E taua tele le faʻamautinoa o loʻo faʻapipiʻi uma au PCB i totonu o le fata ola.E fa'aopoopo i meafaitino ma fa'agaioiga e fa'auma ai le fa'auma, e matua'i a'afia le ola fa'aumae PCBs afifiina ma teuina.O le tagata talosaga sa'o mo le teuina o auala o lo'o fautuaina mai e le IPC-1601 ta'iala o le a fa'atumauina le fa'auma ma fa'amaoni.

Table3 Fa'atusatusaga o le ola i le va'aiga lauiloa i luga ole PCB

 

OLA SHEL masani

Fautuaina le Ola Fa'asa

Avanoa Toe Fai

HASL-LF

12 masina

12 masina

IOE

OSP

3 masina

1 masina

IOE

ENIG

12 masina

6 masina

LEAI*

ENEPIG

6 masina

6 masina

LEAI*

Electrolytic Ni/Au

12 masina

12 masina

NO

IAg

6 masina

3 masina

IOE

ISn

6 masina

3 masina

IOE**

* Mo le ENIG ma le ENEPIG e faʻamaeʻaina se taamilosaga toe faʻafouina e faʻaleleia atili ai le susu ma o loʻo avanoa.

** E le o fautuaina le toe fa'aogaina o le apa vaila'au.

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Taimi meli: Nov-16-2022

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